Preface
About the Author
1. Semiconductor Technology Trends
1.1. Temperature-Dependent Failures
1.1.1. Temperature-Dependent Mechanical Failures
1.1.2. Temperature-Dependent Corrosion Failures
1.1.3. Temperature-Dependent Electrical Failures
1.2. Importance of Heat Transfer in Electronics
1.3. Thermal Design Process
2. Energy, Energy Transfer, and Heat Transfer
2.1. Energy and Work
2.2. Macroscopic and Microscopic Energies
2.3. Energy Transfer and Heat Transfer
2.4. Equation of State
3. Principle of Conservation of Energy
3.1. First Law of Thermodynamics
3.2. Energy Balance for a Control Mass
3.3. Energy Balance for a Control Volume
4. Heat Transfer Mechanisms
4.1. Conduction Heat Transfer
4.2. Convection Heat Transfer
4.2.1. Simplified Correlations for Convection Heat Transfer in Air
4.3. Radiation Heat Transfer
5. Thermal Resistance Network
5.1. Thermal Resistance Concept
5.2. Series Thermal Layers
5.3. Parallel Thermal Layers
5.4. General Resistance Network
5.5. Thermal Contact Resistance
5.6. Thermal Interface Materials
5.7. Spreading Thermal Resistance
5.8. Thermal Resistance of Printed Circuit Boards (PCBs)
6. Thermal Specification of Microelectronic Packages
6.1. Importance of Packaging
6.2. Thermal Specifications of Microelectronic Packages
6.2.1. Junction-to-Air Thermal Resistance
6.2.2. Junction-to-Case and Junction-to-Board Thermal Resistances
6.2.3. Package Thermal Characterization Parameters
6.2.4. Package Thermal Resistance Network
6.2.5. Parameters Affecting Thermal Characteristics of a Package
6.3. Device Power Dissipation
6.4. Board Size and Thermal Conductivity
7. Fins and Heat Sinks
7.1. Infinitely Long Fin
7.2. Adiabatic Fin Tip
7.3. Convection and Radiation from Fin Tip
7.4. Constant Temperature Fin Tip
7.5. Fin Thermal Resistance, Effectiveness, and Efficiency
7.6. Fins with Variable Cross Sections
7.7. Heat Sink Thermal Resistance, Effectiveness, and Efficiency
7.8. Heat Sink Manufacturing Processes
8. Problems
9. Heat Conduction Equation
9.1. One-Dimensional Heat Conduction Equation for a Plane Wall
9.2. General Heat Conduction Equation
9.3. Boundary and Initial Conditions
9.3.1. Temperature Boundary Condition
9.3.2. Heat Flux Boundary Condition
9.3.3. Convection Boundary Condition
9.3.4. Radiation Boundary Condition
9.3.5. General Boundary Condition
9.3.6. Interface Boundary Condition
9.4. Steady-State Heat Conduction
9.4.1. One-Dimensional, Steady-State Heat Conduction
9.4.2. Two-Dimensional, Steady-State Heat Conduction
9.5. Transient Heat Conduction
9.5.1. Simple Lumped System Analysis
9.5.2. General Lumped System Analysis
9.5.3. Validity of Lumped System Analysis
10. Fundamentals of Convection Heat Transfer
10.1. Type of Flows
10.1.1. External and Internal Flows
10.1.2. Forced and Natural Convection Flows
10.1.3. Laminar and Turbulent Flows
10.1.4. Steady-State and Transient Flows
10.2. Viscous Force, Velocity Boundary Layer, and Friction Coefficient
10.3. Temperature Boundary Layer and Convection Heat Transfer Coefficient
10.4. Boundary Layer Equations
11. Forced Convection Heat Transfer: External Flows
11.1. Normalized Boundary Layer Equations
11.2. Reynolds Number, Prandtl Number, Eckert Number, and Nusselt Number
11.3. Functional Forms of Friction Coefficient and Convection Heat Transfer Coefficient
11.4. Flow over Flat Plates
11.4.1. Laminar Flow over a Flat Plate with Constant Temperature
11.4.2. Turbulent Flow over a Flat Plate with Uniform Temperature
11.4.3. Flow over a Flat Plate with Uniform Surface Heat Flux
11.5. Flow Across Cylinders
11.6. Cylindrical Pin-Fin Heat Sink
11.7. Procedure for Solving External Forced Convection Problems
12. Forced Convection Heat Transfer: Internal Flows
12.1. Mean Velocity and Mean Temperature
12.2. Laminar and Turbulent Pipe Flows
12.3. Entry Length and Fully Developed Flow
12.4. Pumping Power and Convection Heat Transfer in Internal Flows
12.5. Velocity Profiles and Friction Factor Correlations
12.6. Temperature Profiles and Convection Heat Transfer Correlations
12.7. Fans and Pumps
12.7.1. Types of Fans
12.7.2. Fan Curve and System Impedance Curve
12.7.3. Types of Pumps
12.8. Plate-Fin Heat Sinks
13. Natural Convection Heat Transfer
13.1. Buoyancy Force and Natural Convection Flows
13.2. Natural Convection Velocity and Temperature Boundary Layers
13.3. Normalized Natural Convection Boundary Layer Equations
13.3.1. Grashof and Rayleigh Numbers
13.3.2. Functional Form of the Convection Heat Transfer Coefficient
13.4. Laminar and Turbulent Natural Convection over a Vertical Flat Plate
13.5. Natural Convection around Inclined and Horizontal Plates
13.6. Natural Convection around Vertical and Horizontal Cylinders
13.7. Natural Convection in Enclosures
13.8. Natural Convection from Array of Vertical Plates
14. Radiation Heat Transfer
14.1. Radiation Intensity and Emissive Power
14.2. Radiation Properties of Surfaces
14.3. Solar and Atmospheric Radiations
14.4. Radiation Heat Transfer between Black Bodies
14.5. Radiation Heat Transfer between Nonblack Bodies
14.6. Radiation Heat Transfer from a Plate-Fin Heat Sinks
15. Computer Simulations and Thermal Design
15.1. Heat Transfer and Fluid Flow Equations: A Summary
15.2. Fundamentals of Computer Simulation
15.2.1. Steady-State, One-Dimensional Heat Conduction
15.2.2. Steady-State, Two-Dimensional Heat Conduction
15.2.3. Transient Heat Conduction
15.2.4. Fluid Flow and Energy Equations
15.3. Solution of Finite-Difference Equations
15.4. Commercial Thermal Simulation Tools
15.4.1. Creating the Thermal Model
15.4.2. Creating the Mesh
15.4.3. Solving Flow and Temperature Equations
15.4.4. Review the Results
15.4.5. Presenting the Results
15.5. Importance of Modeling and Simulation in Thermal Design
16. Experimental Techniques and Thermal Design
16.1. Flow Rate Measurement Techniques
16.2. System Impedance Measurement
16.3. Fan and Pump Curve Measurements
16.4. Velocity Measurement Methods
16.5. Temperature Measurement Techniques
16.6. Acoustic Noise Measurements
16.7. Importance of Experimental Measurements in Thermal Design
17. Advanced Cooling Technologies
17.1. Other Heat Pipe Performance Limits
17.2. Heat Pipe Applications in Electronic Cooling
17.3. Heat Pipe Selection and Modeling
17.4. Thermosyphons, Loop Heat Pipes, and Vapor Chambers
Appendix: Tables of Material Properties
