VIETNAM NATIONAL UNIVERSITY, HANOI COLLEGE OF TECHNOLOGY Phan Huu Phu SENSING MICROGRIPPER WITH PID CONTROL SYSTEMS MASTER THESIS Hanoi - 2008 z VIETNAM NATIONAL UNIVERSITY, HANOI COLLEGE OF TECHNLOGY Phan Huu Phu SENSING MICROGRIPPER WITH PID CONTROL SYSTEMS Major: Electronics and Telecommunications Technology Concentration: Electronics Engineering Code: 60 52 70 MASTER THESIS SUPERVISOR: Dr. Chu Duc Trinh Hanoi - 2008 z 2 TABLE OF CONTENTS DECLARATION.5 LIST OF ABBREVIATIONS .1 MANIPULATION IN MICRO-WORLD .2 MICRO-GRIPER FOR MICRO-MANIPULATION .4 Polymeric electrothermal microgripper .3 MICRO-MANIPULATION WITH A FEEDBACK SYSTEM .14 CHAPTER 2 SENSING MICROGRIPPER .2 FORCE-SENSING CANTILEVER.3 SILICON-POLYMER ELECTROTHERMAL MICROGRIPPER.5 THE SENSING MICROGRIPPER CHARACTERISTICS .1 Electrothermal actuator characteristics.2 Sensing cantilever beam characteristics .3 Response frequency of the sensing microgripper .27 CHAPTER 3 BUILDING PID CONTROL FUNCTION .1 FEEDBACK LOOP CONTROL .2 BUILDING A PID TRANSFER FUNCTION FOR THE SENSING MICROGRIPPER SYSTEM .1 Transfer function of sensing microgripper .2 Transfer function of driver circuit .3 Open-loop control .5 Proportional – Integral control.6 Proportional – Derivative control.7 Proportional – Derivative – Integral control .34 CHAPTER 4 ELECTRICAL DESIGN .2 PROCESS SELECTION AND SIMULATION .3 Silicon-level simulation .4 Analog-only simulation .5 Mixed Analog/Digital simulation .3 SYSTEM BLOCK DIAGRAM .1 Voltage reference generator.2 The high temperature detector: .4 Bias current generator.3 Digital to Analog converter (DAC) .5 FULLY SCHEMATIC OF SYSTEM AND SIMULATION RESULTS .62 CHAPTER 5 PHYSICAL DESIGN .1 INTRODUCTION OF LAYOUT .2 MOS transistor layout .2 SYSTEM FLOOR PLAN .72 CHAPTER 6 CONCLUSION & FUTURE WORKS.1 Finishing the system layout .76 z 6 List of Abbreviations AFM: Atomic Force Microscope AlN: Aluminum Nitride Bi-CMOS: Bipolar junction transistors and CMOS technology CAD: Computer Aid Design CMOS: Complementary Metal-Oxide-Semiconductor CTE: Thermal expansion coefficient DAC: Digital-to-Analog Converter DC: Direct Current DIMES: Delft Institute of Microsystems and Nanoelectronics DOFs: Degrees(s) of Freedom DRC: Design Rules Checking ERC: Electrical Rules Check ESD: Electro Static Discharge FIB-cut: Focused ion beam-cut GDSII: Graphic Data System II IC: Integrated Circuits LSB: Least Significant Bit LSI: Large-Scale Integration LVS: Layout versus Schematic MEMS: Micro-Electro-Mechanical systems MIS: Minimally Invasive Surgery MOSFET: Metal-Oxide Semiconductor Field-Effect Transistor NMOS: N-channel Metal-Oxide Semiconductor Field-Effect Transistor PID: Proportional Integral Derivative PLI: Photolithographic Invariance PMOS: P-channel Metal-Oxide Semiconductor Field-Effect Transistor PSRR: Power supply rejection ratio PTAT: Proportional to Absolute Temperature PVDF: Polyvinylidene Flouride PZT: Lead Zirconate Titanate SEM: Scanning Electron Microscope SOI: Silicon on Insulator SPICE: Simulation Program Integrated Circuit Emphasis TC: Temperature Coefficients UVLO: Under Voltage Lock-Out ZnO2: Zinc peroxide z 7 Chapter 1 Introduction 1.1 Manipulation in micro-world The dominant physical principles in the micro-world can be quite difference from those of the macro-world. When the size of the object is less than 1mm, adhesive forces between the manipulation tool and the object such as surface tension, electrostatic and van der Waals forces can be significant compared to the gravitational force [23]. Manipulation of micro-particles can be done using several physical principles and methods.
For manipulation of a micro-structure under specific ambient conditions or liquid; suction, cryogenic, electrostatic, and friction are the most often considered methods. Friction principle is chosen for addressing the micro-manipulation of small objects presented in this thesis. Like the human hand, friction manipulation uses at least two fingers applies on two sides of a clamped object. A friction manipulator can old an object due to the friction force between the tools and the object surfaces.
This friction method is the most widely used in micro-manipulation because of size, cost, reliability, and fabrication aspect in particular.2 Micro-griper for micro-manipulation In the recent years, microgrippers have been widely researched as they are in great demand in many research and application areas, such as advanced micro-assembly, micromanipulation, micro-robotic, minimally invasive and living cell surgery. For the development of microgrippers fabricated using integrated circuits (IC) or IC compatible technology, electrostatic, piezoelectric and electro-thermal actuation are generally used.1 Electrostatic microgripper The electrostatic principle is based on the distance change between a fixed electrode and a suspended one when the voltage applied to these two electrodes changes. The first successful electrostatic microgripper based on bulk and surface silicon micro- machining techniques was presented in 1992 (see Fig. The 12 µm thick and 1500 µm long polysilicon microgripper is overhanging from a supporting silicon cantilever.